Volume 10, No. 2

In this issue, we explore groundbreaking technological advancements across diverse fields. The first paper presents an innovative method for calibrating cameras with large field of view (FOV) by constructing a virtual large reference plate. This approach overcomes the challenges of fabricating large, high-precision physical reference plates, significantly improving calibration accuracy and measurement precision. Another highlight is the detailed analysis of pressure uncertainty in wafer polishing, crucial for semiconductor manufacturing. The study enhances the reliability of double-side polishing machines, a key factor in producing high-quality wafers.